3986.net
小网站 大容量 大智慧
当前位置:首页 >> 信息与通信 >>

Presentation for wire pull test_图文

Understanding the Wire Bond Pull Test
By Lee Levine Presented by Ray Cathcart

Purpose
? It may appear that the bonder/tool/wire is producing weak wire bonds ? It’s important to understand the data and the test conditions ? The bonds may be weak, or the specs may need to be corrected after reevaluating the process/test methods

2

Some Basics
? The maximum force that the pull test can detect is limited by the strength of the wire. ? The Heat Affected Zone (HAZ) above the ball should be the weakest part of a wirebond. ? Both the ball and the wedge bond welded areas are several times larger than the wire cross section. If the bond lifts or fractures at the interface the bond was defective. ? Preferred failure modes are neck, midspan, heel of second bond, in that order. ? The breaking force measured at the hook is not the same as the force exerted on the wire.

3

Pull Test Resolution of Forces

4

Simplified Equations for Pull Test

= F* M1

= F* M2

5

Pull Test R.O.F. Simplified
F1 = M1*F F2 = M2*F where F = Pull Test Measurement F1, F2 = Force on the wire at 1st or 2nd Bond

6

Low Pull Test Values?
? Do 1st and 2nd bond pull tests. If the values are close to the strength of the wire (80%) and the failure mode is good (no lifts) then the problem is loop geometry. ? If 1st or 2nd bond pull tests are weak, or if lifts occur, it’s a parameter or material problem. DOEs or plasma cleaning may help.

7

Low Loop Heights (TSOP Packages)

? M1 & M2 are > 1; Range 1-3 ? Pull Test readings are lower than the actual force in the wire ? Perception that bonds are weak MAY be incorrect
F1 = M1*F F2 = M2*F

8

High or Standard Loop Height
? M1 & M2 < 1 ? Range for M1 & M2 .5 to 1.0 ? Force in Wire is lower than the Test Force ? If the Wire Break Load is 10 grams then the Pull Test results are higher than 10 grams.
F1 = M1*F F2 = M2*F

9

Hook Location
? Mid span means that the angle of the wire at 1st and second bond is equal, resulting in the same force in each leg. ? It is NOT the middle of the loop length when the die is higher than 2nd bond. ? A 10-20% deviation from mid span doesn’t have a significant effect on the results.

10

Pull Test Excel Template
8

Input Data
7

Pull Test Force [grams]

6 5 4
X

H d h lhp ts

10 210 6 0 7.5

Pull-Test Mid-Span e hl 40% 84%

3 2 1 0

0

5 10 15 20 25 30 35 40 45 50 55 65 70 75 80 85 90 95 100 Hook Location [% of d from 1st bond]
1st Bond Break Force 2nd Bond Break Force
X

Pull-Test Mid-Span Point

11

Conclusions
? Understand the geometry. ? The goal is strong bonds, not high numbers. ? Be honest, it’s easy to deceive yourself and the customer by pulling in a location that masks a weak bond. ? The pull test is limited to the strength of the wire. Shear strength determines the strength of the weld interface. ? Very low loops may have low pull strength values for strong welds because the geometry multiplier is >1. ? The Pull strength template is a useful tool to explain the variables of the pull test. Especially when there is a communications problem with a customer. Be sure you have the facts on your side.
12


推荐相关:

Presentation for wire pull test_图文.pdf

Presentation for wire pull test_信息与通信_工程科技_专业资料。Wire pull test, wire bonding reference book. Understanding the Wire Bond Pull Test By Lee ...


WT wire presentation合金线_图文.pdf

Mechanical Properties Pull Test (g) of 1.0 mil wire Shear Test (g) of...Presentation for wire ... 12页 5下载券 Heraeus Copper Wire Pr... 30页...


PROCESS Presentation FOR TOSA_图文.ppt

PROCESS Presentation FOR TOSA_信息与通信_工程科技_专业资料。TOSA详解 ...b. Wire bonding. c. Seam sealing d. LIV test e. Burn-in. f. LIV ...


Wire Bonding_图文.ppt

WIRE K&S Ultra Electronic Flame-Off WIRE PULL TEST Wire Failure 4 Stitch ...Various Looping (For advanced package) S-CSP SS-SCSP S-TCSP 3S-CSP 4S-...


WB Capillary Presentation_图文.pdf

for smoother wire stream, but may fail to finely adjust the bond placement...Optimum Tip Higher pull test values are expected in the 2nd bond Smaller ...


TSC Company Presentation_图文.pdf

TSC Company Presentation_公务员考试_资格考试/认证_教育专区。台湾半导体介绍 ...PDFN5x6 and Al-wire Bonded MOSFET in PDFN5x6, TO220, ITO220 (TO220...


IC package presentation 20090514_图文.ppt

Wire Bonding Process 49 Grinding Presentation 50 ...And it could increase pull strength and yield of...(SPECIALLY FOR SMD SOIC、PLCC) 132 Final Test ...


DOE 田口presentation-Example2_图文.pdf

(ea) 1608 9900 : Wire bonder K&S 8028 : DA : 8L 3*1.9mm TDFN :...Ball shear test Bond pull test Cratering test Ball size measurement Analyze ...


Magnetic_Encoder_for_General_presentation_图文.pdf

Magnetic_Encoder_for_General_presentation_音频/视频...Wire savings - cascading multiple sensors: - ...Audio equipment - Test and instrumentation equipment...


EMC presentation_图文.ppt

EMC presentation_信息与通信_工程科技_专业资料。...Tricks and tips to pass EMC test ? 1. reduce...-- shield cover on wire or IC. ? 2. ...


wire_bonding__介绍_图文.pdf

Wire Pull ? Ball short ? Crater Test ? 位: um or Mil BPO&BPP ? ...(typical Au to Al) Full ball attached to wire-except for regions of ...


presentation_图文.ppt

presentation_英语学习_外语学习_教育专区。关于90后喜欢的东西 Our childhood 童年...Makes a circle with the iron wire, then makes a long handle's hard ...


NATCONN Company Presentation_图文.ppt

This is a presentation for Natconn, who are a ...Ray Test Hardness Tester Insertion tester High ...E355923 Wire harness UL: 20140904-E470878 Brand ...


enepig soldering presentation化学镍钯金_图文.pdf

enepig soldering presentation化学镍钯金_电子/电路_...Wire bonding Test point probing Exposed Copper ...Cold Ball Pull Test Reflow After Ball ...


Ball pull test_图文.pdf

Advanced Packaging - Understanding the Complexities of Solder Ball Pull Testing...Pull-off test method 6页 免费 Presentation for wire ... 12页 5下载券...


COB_wire_bonding原理介绍_图文.pdf

Wire Pull ? Ball short ? Crater Test ? 位: um or Mil BPO&BPP ? ...(typical Au to Al) Full ball attached to wire-except for regions of ...


wire bonding介绍_图文.ppt

Wire Pull ? Ball short ? Crater Test ? 位: um or Mil BPO&BPP ? ...(typical Au to Al) Full ball attached to wire-except for regions of ...


HST- Presentation_图文.pdf

Test - Product Modification Dispatch Quality ...High Volume / Low Cost Stampings Wire ...Wires potted for high pull strength Insert molded...


Future Hover Copper WirePresentation CU_图文.pdf

Future Hover Copper WirePresentation CU_电子/电路_工程科技_专业资料。EAGLE ...from customer: PCT test for FH-25um Wire Sample Size Test item Pre-cond...


安飞诺公司简介CAPG presentation -2010 en-11.25.2010_图文.pdf

Wire harness of cable assebly Wire harness of overmoulding for Engine, Ses...Pull Test machine Cross section analysis Amphenol Automotive Product Group ...

网站首页 | 网站地图
3986 3986.net
文档资料库内容来自网络,如有侵犯请联系客服。zhit325@qq.com